When the Signal Changes Return Plane and its Mitigation Methods
Taher Ujjainwala
, Bhargav Dharmendra Chauhan , Guariech Ishaan Pilla
Printed Circuit Board, Signal Integrity, Ground Bounce, Cavity Noise, HFSS, ADS
In this paper, we investigate the effects of signal transitions between layers in a 4-layer printed circuit board (PCB) with a stack-up of signal-ground-ground-signal (S-G-G-S) . We observe impedance changes and cavity noise, leading to ground bounce when the signal transitions from the top layer to the bottom layer [1]. To mitigate these effects, we examine the difference in crosstalk when the return path for the signal is present and when it is removed. We use a high-frequency structure simulator (HFSS) and Advanced Design System (ADS) to simulate and model the system in frequency domain, extract S-parameter data, and plot graphs to verify our results. The main objective of this project is to demonstrate the importance of proper return path design for high-speed signals in multi-layer PCBs.
"When the Signal Changes Return Plane and its Mitigation Methods", IJSDR - International Journal of Scientific Development and Research (www.IJSDR.org), ISSN:2455-2631, Vol.9, Issue 6, page no.498 - 506, June-2024, Available :https://ijsdr.org/papers/IJSDR2406061.pdf
Volume 9
Issue 6,
June-2024
Pages : 498 - 506
Paper Reg. ID: IJSDR_211610
Published Paper Id: IJSDR2406061
Downloads: 000347089
Research Area: Electrical Engineering
Country: Wauwatosa, Wisconsin, United States
DOI: https://doi.org/10.5281/zenodo.11631131
ISSN: 2455-2631 | IMPACT FACTOR: 9.15 Calculated By Google Scholar | ESTD YEAR: 2016
An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 9.15 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator
Publisher: IJSDR(IJ Publication) Janvi Wave
