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INTERNATIONAL JOURNAL OF SCIENTIFIC DEVELOPMENT AND RESEARCH
International Peer Reviewed & Refereed Journals, Open Access Journal
ISSN Approved Journal No: 2455-2631 | Impact factor: 8.15 | ESTD Year: 2016
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Paper Title:	Electroplating of copper on Tungsten powder
Authors Name:	Sumaira Masood
Unique Id:	IJSDR2112040
Published In:	Volume 6 Issue 12, December-2021
Abstract:	Main object is to coat the tungsten powder with copper and material is obtained in bulk in batch process.
Keywords:	Electroplating , copper , tungsten , electrolytic deposition
Cite Article:	"Electroplating of copper on Tungsten powder", International Journal of Science & Engineering Development Research (www.ijsdr.org), ISSN:2455-2631, Vol.6, Issue 12, page no.247 - 248, December-2021, Available :http://www.ijsdr.org/papers/IJSDR2112040.pdf
Downloads:	000337070
Publication Details:	Published Paper ID: IJSDR2112040 Registration ID:193786 Published In: Volume 6 Issue 12, December-2021 DOI (Digital Object Identifier): Page No: 247 - 248 Publisher: IJSDR \| www.ijsdr.org ISSN Number: 2455-2631

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