Electroplating of copper on Tungsten powder

Sumaira Masood

Electroplating , copper , tungsten , electrolytic deposition

Main object is to coat the tungsten powder with copper and material is obtained in bulk in batch process.

Published Paper   E-Certificate

"Electroplating of copper on Tungsten powder", IJSDR - International Journal of Scientific Development and Research (www.IJSDR.org), ISSN:2455-2631, Vol.6, Issue 12, page no.247 - 248, December-2021, Available :https://ijsdr.org/papers/IJSDR2112040.pdf

Volume 6 Issue 12, December-2021

Pages : 247 - 248

Paper Reg. ID: IJSDR_193786

Published Paper Id: IJSDR2112040

Downloads: 000347212

Research Area: Engineering

Country: Srinagar, Jammu and Kashmir, India

Published Paper PDF: https://ijsdr.org/papers/IJSDR2112040

Published Paper URL: https://ijsdr.org/viewpaperforall?paper=IJSDR2112040

ISSN: 2455-2631 | IMPACT FACTOR: 9.15 Calculated By Google Scholar | ESTD YEAR: 2016

An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 9.15 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator

Publisher: IJSDR(IJ Publication) Janvi Wave

This work is licensed under a Creative Commons Attribution 4.0 International License and The Open Definition