INTERNATIONAL JOURNAL OF SCIENTIFIC DEVELOPMENT AND RESEARCH International Peer Reviewed & Refereed Journals, Open Access Journal ISSN Approved Journal No: 2455-2631 | Impact factor: 8.15 | ESTD Year: 2016
open access , Peer-reviewed, and Refereed Journals, Impact factor 8.15
Muthusamy K
, Prem kumar S , Madhu A K , Srinivasagam ramesh , Muthiah A
Unique Id:
IJSDR2105039
Published In:
Volume 6 Issue 5, May-2021
Abstract:
All electronics devices dissipate heat to a large extent. Sufficient cooling is required to maintain their transistors; an electronic device is used in several applications. We have considered the transistor in the electrical contractor application. Our aim is to design a heat sink which could efficiently remove the heat dissipated by the transistor. In this project different materials heat sink for same base area and same heat input is considered and performance of the heat sink is analysis. The experimental analysis for aluminum and copper fins.
"Performance Analysis of Heat Sink", International Journal of Science & Engineering Development Research (www.ijsdr.org), ISSN:2455-2631, Vol.6, Issue 5, page no.231 - 234, May-2021, Available :http://www.ijsdr.org/papers/IJSDR2105039.pdf
Downloads:
000337077
Publication Details:
Published Paper ID: IJSDR2105039
Registration ID:193263
Published In: Volume 6 Issue 5, May-2021
DOI (Digital Object Identifier):
Page No: 231 - 234
Publisher: IJSDR | www.ijsdr.org
ISSN Number: 2455-2631
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