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INTERNATIONAL JOURNAL OF SCIENTIFIC DEVELOPMENT AND RESEARCH International Peer Reviewed & Refereed Journals, Open Access Journal ISSN Approved Journal No: 2455-2631 | Impact factor: 8.15 | ESTD Year: 2016 open access , Peer-reviewed, and Refereed Journals, Impact factor 8.15 |
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| Paper Title: | CONSIDERATIONS - LED DIE ATTACH TECHNOLOGIES |
| Authors Name: | Suma Gurulingaiah Charantimath , Sindhu R , Firdosh P , Vidhya B |
| Unique Id: | IJSDR2101029 |
| Published In: | Volume 6 Issue 1, January-2021 |
| Abstract: | Die attach material plays a key role in performance and reliability of mid, high and super-high power LEDs. The selection of the suitable die-attach material for a particular chip structure and application depends on several considerations. These include packaging process (throughput and yield), performance (thermal dissipation and light output), reliability (lumen maintenance) and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones and sintered materials have all been used for LED dieattach. Often, use of a particular technology platform results in trade-off between different attributes. This white paper reviews process, performance and reliability attributes of the die attach technologies. Then it addresses the fit between these die-attach materials, different chip structures (like lateral, vertical and flip-chip) and their operating power levels. Finally it describes the positioning of different technologies for applications in general lighting segment. This review clearly shows that given the diversity in chip structures, package designs and applications, all material platforms have a place in LED die attach. A diverse portfolio that provides die attach options to LED device makers and packagers is required to meet the process and performance demands in this rapidly changing market. |
| Keywords: | LED, Packaging, Die Attach, Silver Sintering, Conductive Adhesive, Solder, AuSn |
| Cite Article: | "CONSIDERATIONS - LED DIE ATTACH TECHNOLOGIES ", International Journal of Science & Engineering Development Research (www.ijsdr.org), ISSN:2455-2631, Vol.6, Issue 1, page no.194 - 198, January-2021, Available :http://www.ijsdr.org/papers/IJSDR2101029.pdf |
| Downloads: | 000337070 |
| Publication Details: | Published Paper ID: IJSDR2101029 Registration ID:192849 Published In: Volume 6 Issue 1, January-2021 DOI (Digital Object Identifier): Page No: 194 - 198 Publisher: IJSDR | www.ijsdr.org ISSN Number: 2455-2631 |
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